Senior Application Engineer Bonding and Microassembly (m/f/d)

You have already developed and implemented demanding die-mounting and precision assembly processes on FINEPLACER systems or comparable systems? At Finetech you take the technical responsibility for customer applications – from feasibility assessment to stable process to documented transfer and customer training. We are looking for an experienced specialist who provides their well-founded machine and process practice directly. After a short, targeted incorporation into our specific systems, products and processes, you will take over first matching customer projects independently. We presuppose the safe control of the basics of die-bonding and precision assembly. · You clarify customer requirements, evaluate technical feasibility and define measurable success criteria, test plans, effort and resources. Technical risks and missing information are discussed at an early stage. · You select machine configurations, process modules, bonding tools and component images and specify necessary adaptations together with design and development. · You prepare components and systems, align bonding processes yourself and optimize alignment, positioning as well as relevant temperature, force and time profiles. In automated systems, you develop process recipes and image processing processes. · You develop and validate reproducible assembly and joining processes, for example for die-attack, flip-chip, photonic components or microsystems. You systematically limit fault causes and guide loadable process windows. · You evaluate results with suitable measurement and testing methods and document parameters, patterns, results and limits comprehensible in application reports and our CRM. · You accompany the transition from the feasibility study to the customer order, support process removal in the factory and the customer and carry out application-specific trainings as well as challenging troubleshooting. · You advise international customers together with sales and service, support technical offers and services and communicate effort, dates and deviations bindingly. · You make process knowledge reusable as standards and reference applications, support colleagues professionally and participate in demos, trade fairs and technical marketing content.

That's what you're bringing · At least five years of relevant professional experience in practical application or process development for die-bonding, flip-chip or high-precision microassembly. · Extensive own practice with FINEPLACER systems or technologically comparable precision die drilling or flip-chip drilling. You have set up these systems yourself, developed processes and fixed errors. Similar alignment, positioning and joining tasks in the micrometer or submicrometer range are decisive. · A secure understanding of the entire process chain: component and substrate evaluation, material compatibility, tooling, optical alignment, parallelism, component handling, process management and quality assessment. You can explain interactions between machine, tool, material and process in a comprehensible manner. Finded practical experience in at least two relevant joining technologies, for example adhesive bonding or die-attack, thermocompression bonding, eutectic soldering or thermosonic or ultrasonic bonding. · Detectional successes with independent customer or development projects – from request clarification to reproducible results and a durable technical documentation. · A technical or scientific study, for example in microsystems engineering, mechanical engineering, mechatronics, materials engineering or physics, or a comparable qualification with corresponding relevant practice. · A structured, analytical method and experience with systematic experimental planning, measurement data evaluation and analysis of causes. You work safely with sensitive components and know ESD and cleanliness requirements. · German knowledge at least at level B2 of the Common European Framework of Reference and good English knowledge for technical advice, documentation and training. · You are based in Berlin or Berlin and can work regularly on our machines. Occasionally international business trips to customers and events are possible for you. In addition, advantage Experience with automated bonding platforms, statistical experimental planning (DoE) and process capability as well as with applications in photonics, optoelectronics, MEMS or advanced packaging. Experiences with customer acceptance, training and the professional transfer of process knowledge are also helpful.

Open corporate culture that encourages self-responsibility and allows to introduce yourself personally A modern working environment with numerous parking spaces, a large shared kitchen, sun terrace and beach volleyball field Daily free drinks and fresh fruit Promoting health and sporting activities Family-friendly working hours with core and sliding time Fair remuneration Aid for occupational pension provision E-Bike and Bicycle Lease Program JobRad Possibility of company e-bikes