0Technical Assistant – Plasma Coating and Dry Etching Processes
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM | Germany | 01xxx Moritzburg | Temporary contract | Part time - flexible / Full time | Published since: 05.02.2026 on stepstone.de

Technical Assistant – Plasma Coating and Dry Etching Processes

Branch: Humanities Branch: Humanities


The Fraunhofer Society is one of the world's leading organisations for application-oriented research. 75 institutes develop groundbreaking technologies for our economy and society – more precisely: 32 000 people from technology, science, administration and IT. You know, who comes to Fraunhofer wants and can change something. For yourself, for us and the markets of today and tomorrow. The Fraunhofer Institute for Reliability and Microintegration IZM is a world leader in the field of microelectronic packaging.

The "All Silicon System Integration Center Dresden" (ASSID) of the Fraunhofer IZM with its location in Dresden – Moritzburg specializes in wafer-level packaging, heterogeneous system integration and wafer-level system-in-package architectures. Special focus is on technologies of 3D integration technologies such as Through Silicon Via, Wafer-Bonding, Interposer, Die-Stacking and Assembly. The IZM-ASSID has a state-of-the-art 300/200 mm wafer-level process line for qualified process development and application-specific product adaptation. We work closely with partners from industry and science as well as material and equipment manufacturers. As a technical assistant in the field of plasma coating and dry etching processes, you are also responsible for the process engineering support and further development of the PVD, CVD and RIE processes – from the testing of innovative process controls to the further development of series suitability. In this process, you will deal intensively and comprehensively with the complex plant technology, from operation to technical improvement in the clean room, and work closely with the plant manufacturers. .

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The Fraunhofer Society is one of the world's leading organisations for application-oriented research. 75 institutes develop groundbreaking technologies for our economy and society – more precisely: 32 000 people from technology, science, administration and IT. You know, who comes to Fraunhofer wants and can change something. For yourself, for us and the markets of today and tomorrow. The Fraunhofer Institute for Reliability and Microintegration IZM is a world leader in the field of microelectronic packaging.

The ''All Silicon System Integration Center Dresden'' (ASSID) of the Fraunhofer IZM with its location in Dresden – Moritzburg specializes in wafer-level packaging, heterogeneous system integration and wafer-level system-in-package architectures. Special focus is on technologies of 3D integration technologies such as Through Silicon Via, Wafer-Bonding, Interposer, Die-Stacking and Assembly. The IZM-ASSID has a state-of-the-art 300/200 mm wafer-level process line for qualified process development and application-specific product adaptation. We work closely with partners from industry and science as well as material and equipment manufacturers. As a technical assistant in the field of plasma coating and dry etching processes, you are also responsible for the process engineering support and further development of the PVD, CVD and RIE processes – from the testing of innovative process controls to the further development of series suitability. In this process, you will deal intensively and comprehensively with the complex plant technology, from operation to technical improvement in the clean room, and work closely with the plant manufacturers.

Independent planning, implementation and further development of production processes at vacuum systems for 8'' and 12'' wafer processing in compliance with existing quality and safety requirements Predictive troubleshooting and problem solving when lifting demanding fault images on electrical, electronic and mechanical systems in a team with maintenance technicians Technical communication with plant manufacturers for the joint further development of plant engineering Application of modern analysis methods for layer characterization and evaluation of measurement results independent operation of the systems and re-qualification of process chambers after maintenance measures Implementation of smaller development projects in cooperation with plant manufacturers and project partners

Completed (specialist) university degree (Bachelor or FH Diploma) of an engineering science discipline Professional practice in vacuum plasma processes, ideally in semiconductor production, especially in the field of magnetron sputtering (HiPIMS), PECVD and/or RIE and the associated technical systems Scientific and technical understanding of the technical exchange with plant manufacturers, as well as first experience in the management of projects in cooperation with plant manufacturers A careful, structured, creative and independent way of working, paired with hands-on mentality Joy of an experimental activity directly at process plants in the clean room Very good German and good English

A varied activity in the high-tech environment of a modern research institute Space for independent work and creative cooperation Participation in international trade fairs Personal development opportunities through further qualification in heterogeneous system integration Flexible working hours and solutions to ensure the reconciliation of family and work Holiday entitlement of 30 days and social benefits according to the TVöD Confederation and occupational pensions (VBL) Beneficiary company or BVG Germany Ticket Free parking

Location

ava Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Moritzburg
Germany

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